At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new jobs. Of the three technology focus areas destined to receive funding, one of interest to ElectronicsCooling readers involves … [Read more...]
Sticking Plaster and Light beats Skin Cancer
Thermal management of LEDs (Light Emitting Diodes) is an important application for CFD software, which is helping designers use LEDs for high-power lighting applications. However, LEDs are changing our lives in so many more ways than simply providing more energy efficient or more aesthetic lighting solutions. Last year I posted about a light therapy device that desensitizes the … [Read more...]
IBM Work to take Moore’s Law to 2025
It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to 10,000 connections … [Read more...]
Roundup of SEMI-THERM, FloTHERM IC launch and JEDEC
I’m just back from a very productive SEMI-THERM Conference where we launched our new FloTHERM IC product. We had meetings with the editors of 5 leading electronics magazines to coincide with the launch, which was made at our vendor presentation during the exhibition at the start of Tuesday afternoon. Well done to all involved! If you want to see what others are saying about … [Read more...]
IC package representation is central to Electronics Cooling
Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier … [Read more...]
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