Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key assembly of Nuventix products. Under the terms of the agreement, Nypro will perform new product introduction and manufacturing services for Nuventix. Nypro will provide development and … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
Department of Energy announces $100 million for innovative research projects
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new jobs. Of the three technology focus areas destined to receive funding, one of interest to ElectronicsCooling readers involves … [Read more...]
Sticking Plaster and Light beats Skin Cancer
Thermal management of LEDs (Light Emitting Diodes) is an important application for CFD software, which is helping designers use LEDs for high-power lighting applications. However, LEDs are changing our lives in so many more ways than simply providing more energy efficient or more aesthetic lighting solutions. Last year I posted about a light therapy device that desensitizes the … [Read more...]
IBM Work to take Moore’s Law to 2025
It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to 10,000 connections … [Read more...]
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