Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier … [Read more...]

Just a very quick post to alert you to the new ElectronicsCooling Magazine web site.  We’ve updated the look of the site to improve navigation ahead of the relaunch of the printed magazine. Here’s just some of the features of the new site: New look and feel Search Improved Article and Content Navigation by author; category (Calculation Corner, New Products, … [Read more...]

I was on a conference call and WebEx yesterday with the NAFEMS CFD Working Group, of which Mentor Graphics is a member. One of the people on the call had a lot of background noise on his phone, which turned out to be a due to a fan by his desk to keep his computer cool. Computational Fluid Dynamics (CFD) is a memory hungry, CPU intensive activity so I guess he was running a … [Read more...]

I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far. The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the IEEE’s THERMI Award. Short courses at … [Read more...]