Small Fans for Cooling Small Electronic Devices Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd. The growing portable device market boosts the development of small electric devices, such as Ultra Mobile PC, Pico projector, Smart Phone, etc. One laptop cooling solution is the fan-less cooling technology that transports the CPU heat by using a heat pipe. … [Read more...]
On (the Lack of) Thermal Education
Some like it hot, others do not. And those others for sure include the designers of products that contain electronics. There is a growing need to educate designers who are involved with the undesired side-effects of heat-dissipating components. We often see the following situation. At some moment in time, it is ascertained that a product is getting too hot, and if it turns out … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
Advanced Aerodynamics for Electronics Cooling Fans
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these fans has progressed to a lesser degree, and is far removed from turbomachines used in higher power … [Read more...]
A Simple Method to Estimate Boiling Heat Sink Performance
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
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