Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
Cooling Electronics with Nanofluids: Laminar Convective Heat Transfer
Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
Antifreeze Coolants
Removing waste heat from electronic assemblies using a circulating liquid coolant is a common and effective method with a long and successful history, especially in avionics and data center applications. The choice of coolant depends on many factors including corrosion resistance, cost, thermal properties, regulatory constraints, thermal stability, and environmental temperature … [Read more...]
Emissivity in Practical Numerical Modeling
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the measured values as discussed in the column mentioned? Let me summarize the main points of it: Emissivity is not only a material property but also a surface … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
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