Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
Small Fans for Cooling Small Electronic Devices
Small Fans for Cooling Small Electronic Devices Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd. The growing portable device market boosts the development of small electric devices, such as Ultra Mobile PC, Pico projector, Smart Phone, etc. One laptop cooling solution is the fan-less cooling technology that transports the CPU heat by using a heat pipe. … [Read more...]
On (the Lack of) Thermal Education
Some like it hot, others do not. And those others for sure include the designers of products that contain electronics. There is a growing need to educate designers who are involved with the undesired side-effects of heat-dissipating components. We often see the following situation. At some moment in time, it is ascertained that a product is getting too hot, and if it turns out … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
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