Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
Thermal Conductivity of Filled Plastics
Compared to other solid materials, metals are widely known for their superior heat transfer capabilities. However, these capabilities come at the cost of weight, coefficient of thermal expansion (CTE) mismatch and freedom of design due to manufacturing constraints. Hence, the desire for thermally-conductive plastics. On the other side of the spectrum, we would like to have … [Read more...]
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not be a pretty picture either for the consumer or the electronics industry if suddenly the design of our electronic gadgets became static. At this … [Read more...]
The Audacity of Engineering
At the time of this writing (mid-November), it appears that significant progress has been made toward avoiding a global financial collapse and that we now have a good chance of avoiding that fate. Unfortunately, it is now clear that, no matter how the credit markets fare, there will be a recession. Even after the world economy picks up again, the world will certainly face an … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
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