Introduction Due to the increasing power density in today's industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and the memory modules. The system level fan speeds are directly dictated (in most cases) by both processor and memory temperatures. Due to the fact that … [Read more...]
Emissivity in Practical Numerical Modeling
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the measured values as discussed in the column mentioned? Let me summarize the main points of it: Emissivity is not only a material property but also a surface … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
Advanced Metal Diamond Composites – Love and Heat Relationship
Introduction Thermal management is a critical issue in high-power laser diode and LED packages, and microprocessor units [1, 2]. Reliability and long life time of electronic packages call not only for materials with high thermal conductivity but also a coefficient of thermal expansion (CTE) matching to that of semiconductors. The thermal expansion of the heat sink material in … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
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