Removing waste heat from electronic assemblies using a circulating liquid coolant is a common and effective method with a long and successful history, especially in avionics and data center applications. The choice of coolant depends on many factors including corrosion resistance, cost, thermal properties, regulatory constraints, thermal stability, and environmental temperature … [Read more...]
Advanced Aerodynamics for Electronics Cooling Fans
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these fans has progressed to a lesser degree, and is far removed from turbomachines used in higher power … [Read more...]
A Simple Method to Estimate Boiling Heat Sink Performance
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Emissivity in Practical Numerical Modeling
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the measured values as discussed in the column mentioned? Let me summarize the main points of it: Emissivity is not only a material property but also a surface … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
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