Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or wall-mount base stations and radio units, include external fins to improve natural convection and radiation heat transfer rates. Early … [Read more...]
Reader Poll Declares ElectronicsCooling a Winner!
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John McCain is the clear winner of the Republican nomination for president, as I draft this column, the contest between Senators Hillary Clinton and Barack Obama to win the … [Read more...]
Liquid Cooling for Datacom Equipment Centers
Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy efficiency is an increasing concern. In fact, the standard implementation of air-cooled designs results in cooling energy … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
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