Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a thermal management solution. A number of articles in ElectronicsCooling have addressed both the issue of increased power dissipation [1-4] and various … [Read more...]
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of vapor compression cooling (VCC) systems are fairly well known. They can provide heat sinks at below ambient temperatures … [Read more...]
Thermal Conductivity Of Liquid Metals
This column deals with the thermal conductivity and melting points of liquid metals. Thinking about liquid metals, many people associate them with high temperatures. It is not widely known that some metallic alloys are liquid below 0�C, with the exception of course of mercury which was already known in ancient times. China's first emperor is said to have been buried in rivers … [Read more...]
On The Hate/Love Relationship Between The U.S. And SI
Last year I devoted some words on correligion: the religious belief in the usefulness of correlations to solve real-life problems. I forgot to mention that correlations have one big advantage; they are dimensionless meaning that they are the same for everyone, including people from outside the US. Unfortunately this is not the case for most common units, and the struggle for … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
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