Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner article will address the use of interdigitated fins to provide a mechanically tolerant thermal path between two opposing surfaces (e.g., the back … [Read more...]
en Route to a Greener Thermal Technology
It's no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer architects have responded by designing systems that use multi-core processors. These processors can use less energy to perform the same workload as their single-core brethren by … [Read more...]
Challenges In Thermal Management Of Memory Modules
The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as equally important; another 21% indicated that cooling was their major challenge; and 12% cited power consumption as a big concern [2]. Another … [Read more...]
Thermo-Reflectance Thermography For Submicron Temperature Measurements
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal of heat generated by various internal system components has become a major design challenge, further complicated by the lack of knowledge of the temperature … [Read more...]
Thermal Properties Of Building Materials
Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some of which are used in heat transfer laboratory environments, in addition to their usual construction applications. Knowledge of thermal conductivity … [Read more...]
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