It's no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer architects have responded by designing systems that use multi-core processors. These processors can use less energy to perform the same workload as their single-core brethren by … [Read more...]
Challenges In Thermal Management Of Memory Modules
The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as equally important; another 21% indicated that cooling was their major challenge; and 12% cited power consumption as a big concern [2]. Another … [Read more...]
Thermo-Reflectance Thermography For Submicron Temperature Measurements
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal of heat generated by various internal system components has become a major design challenge, further complicated by the lack of knowledge of the temperature … [Read more...]
Thermal Properties Of Building Materials
Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some of which are used in heat transfer laboratory environments, in addition to their usual construction applications. Knowledge of thermal conductivity … [Read more...]
Thermal Modeling Approaches Of GaAs Semiconductors
Introduction Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to provide expeditious and accurate answers to trade studies regarding various FET layouts and geometry, metallization schemes, and conduction … [Read more...]
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