Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner article addressed the use of a water-cooled air-to-liquid heat exchanger to reduce computer rack air exhaust temperatures and mitigate the effect of … [Read more...]
Developments with metallic thermal interface materials
Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
Compact thermal modeling in electronics design
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or … [Read more...]
About viscosity
Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that this fluid parcel deforms. This type of deformation is called shear. The ability to withstand shear is a material property called the dynamic viscosity m. The viscosity … [Read more...]
Synthetic jets for forced air cooling of electronics
Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons of reliability, acoustics, cost and portability [2]. In order to support the increasing power … [Read more...]
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