Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a 'design for manufacturability' methodology for forced convection cooled, plate fin arrays used to form high performance heat sinks for electronics cooling applications. In … [Read more...]
Compact thermal modeling in electronics design
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or … [Read more...]
About viscosity
Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that this fluid parcel deforms. This type of deformation is called shear. The ability to withstand shear is a material property called the dynamic viscosity m. The viscosity … [Read more...]
Synthetic jets for forced air cooling of electronics
Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons of reliability, acoustics, cost and portability [2]. In order to support the increasing power … [Read more...]
Moisture permeation in electronics
Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since the movement of heat and moisture are similar (i.e., diffusive), thermal engineers may be … [Read more...]
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