Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons of reliability, acoustics, cost and portability [2]. In order to support the increasing power … [Read more...]
Moisture permeation in electronics
Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since the movement of heat and moisture are similar (i.e., diffusive), thermal engineers may be … [Read more...]
Estimating the effect of intercoolers for computer rack cooling
Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner article addressed the use of a water-cooled air-to-liquid heat exchanger to reduce computer rack air exhaust temperatures and mitigate the effect of … [Read more...]
Developments with metallic thermal interface materials
Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
Compact thermal modeling in electronics design
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years. The primary challenge has been that near-exact physical models of such components (known as detailed thermal models, or … [Read more...]
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