Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
Direct Die Attach Using a Room Temperature Soldering Process
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance along the heat conduction path comes from the thermal interface material (TIM) used between the surfaces of the silicon die and the heat spreader or heat sink. … [Read more...]
Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number
As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased heat loads at chip, module, and system levels of packaging. The article by Mohapatra [1] in this issue of ElectronicsCooling provides a good overview of both dielectric … [Read more...]
An Overview of Liquid Coolants for Electronics Cooling
Introduction The cooling of electronic parts has become a major challenge in recent times due to the advancements in the design of faster and smaller components. As a result, different cooling technologies have been developed to efficiently remove the heat from these components [1, 2]. The use of a liquid coolant has become attractive due to the higher heat transfer coefficient … [Read more...]
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May '98), SiO2 (Aug '04) and III-V semiconductors (Feb '06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1. Thermal Conductivity Data at Room Temperature The first seven rows of Table 1 show thermal conductivity data for natural and isotopically pure Si as … [Read more...]
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