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So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages

 

Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]

Packaging Challenges For High Heat Flux Devices

 

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]

Exploring the Limits of Air Cooling

 

Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]

Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective

 

In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the form where ρ, k, cp, and � represent the density, thermal conductivity, specific heat (at constant pressure) and dynamic viscosity of the fluid. The … [Read more...]

Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number

 

As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased heat loads at chip, module, and system levels of packaging. The article by Mohapatra [1] in this issue of ElectronicsCooling provides a good overview of both dielectric … [Read more...]

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