Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]
Thermal Conductivity of III-V Semiconductors
Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed "III-V" have desirable electrical properties for applications such as microwave integrated circuits, light emitting diodes and laser diodes. Some of the … [Read more...]
Integrated Circuit Package Types And Thermal Characteristics
Introduction Integrated circuits range in power consumption from mW (or maybe microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to over 1,000. With such a broad range of interesting packaging to consider, it is no wonder that any simple generalizations will always find exceptions. This review article will … [Read more...]
GCS Theory Applied to Thermal Interface Materials
There are 819 kinds of Thermal Interface Material (TIM) - those greases, putties, pads and phase change compounds that go between hot electronic components and their heat sinks - and just as many ways to misuse them. This article covers all of them by stating: If a TIM disappoints, it is all your fault for making one or more of these silly mistakes. Never Learning How to Make a … [Read more...]
Cooling Solutions In The Past Decade
Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that thermal management remained a challenging field. Fortunately, developments and improvements in thermal management hardware have assisted the electronics packaging community by enabling higher … [Read more...]
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