Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means higher watt densities, which lead to increased heat. As the operating temperatures of components within a design increase, their performance, stability, and life … [Read more...]
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol and engine oils have, in general, poorer heat transfer properties than most solids. In spite of considerable research efforts, major improvements in … [Read more...]
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins and spread the heat beyond the package footprint and enhance heat transfer to the air. Heat can flow into these planes by conduction either … [Read more...]
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures and larger temperature gradients. Handling these effects makes it more difficult to stay cost competitive, because … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
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