Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins and spread the heat beyond the package footprint and enhance heat transfer to the air. Heat can flow into these planes by conduction either … [Read more...]
Keep Cool by Sensing Current to Control Fans
Control of cooling fans has become increasingly popular as efforts are made to reduce system power consumption and mechanical fan noise. The purpose of including a fan is to reduce temperature and keep it as low as possible. Mean time to failure for a variety of systems increases rapidly as temperature elevates. This has brought about a wide choice of thermally based fan … [Read more...]
Communication Network Power Efficiency Assessment, Limitations and Directions
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by approximately 80% yearly in each of the last three years, and will continue to grow at 60 - 80% annually … [Read more...]
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures and larger temperature gradients. Handling these effects makes it more difficult to stay cost competitive, because … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
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