Silicon dioxide (SiO2) is one of the most common and also one of the most important materials in the world as it is the basis for our windows, beaches and wine glasses. It is also a source of silicon, of course. As such, the thermal conductivity (TC) of the bulk material is well documented. However, in many cases of interest to the thermal management of semiconductors (for … [Read more...]
Opto-electronic Transceiver Modules, a System Design Perspective
Introduction Small Form Factor (SFF) optical transceiver packages for use at 1-2 Gbits/s data rates have been described by several authors [1-5]. These rely on dual miniature optical connectors such as the MT-RJ or the LC to provide optical-component case widths as small as one centimeter. Passive alignment of the optical fibers with the active optical devices is achieved with … [Read more...]
Keep Cool by Sensing Current to Control Fans
Control of cooling fans has become increasingly popular as efforts are made to reduce system power consumption and mechanical fan noise. The purpose of including a fan is to reduce temperature and keep it as low as possible. Mean time to failure for a variety of systems increases rapidly as temperature elevates. This has brought about a wide choice of thermally based fan … [Read more...]
Communication Network Power Efficiency Assessment, Limitations and Directions
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by approximately 80% yearly in each of the last three years, and will continue to grow at 60 - 80% annually … [Read more...]
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers of the board; and some is dissipated by convection and radiation from the exposed surfaces. There has long been a focus on characterizing the … [Read more...]
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