In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
Cooling of a Flat TV Monitor
Thermal design in the consumer electronics business is about dealing with two difficult challenges: The first is to fulfill, and if possible surpass, customer expectations. The second is to do this in ever shortening design cycles. After a main initial use of flat displays as computer monitors, larger flat display screens are now emerging for video purposes: the Flat TV. … [Read more...]
Power Density Challenges Of Next Generation Telecommunication Networks
Despite the current downturn in the telecommunications industry, data transfer (i.e. network traffic) is continuing to grow at a 100% rate [1]. It is already projected that network traffic demand will reach tens of Tb/s in a couple of years from now (see predicted traffic demands from telecommunications analysts Ryan, Hankin & Kent, Figure 1). At the same time, network … [Read more...]
Packaging And Temperature Control Considerations For Planar Waveguide Circuits
Optical Networking The all-optical network has been emerging as a solution to provide higher bandwidth, lower cost systems for handling high capacity network traffic. Due to the inherent limits of copper wire and the high cost-per-bit of electrical systems, service providers will replace electrical components with fiber optic counterparts wherever possible as the cost of the … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
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