Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are consuming more power, generating increased EM fields and more heat. Electronics equipment must comply with radiation limits … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
Electronic Information Exchange
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF) is the most used file format for exchanging printed circuit assembly (PCA) data between electrical and mechanical CAD/CAE systems and for … [Read more...]
Simplified Transient Model for IC Packages
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many times in which it is useful to know how rapidly the temperature of the chip changes when the applied power changes abruptly. This month's column presents a simple … [Read more...]
Effects of electrical noise on thermocouple measurements
Measurements of temperature in electronic equipment and in thermal characterization apparatus are most often made with thermocouples. As with any sensor, the goal is to gather information about the environment in the vicinity of the sensor, in this case the temperature. Unfortunately the environment around the entire instrumentation chain, including the lead wires and the data … [Read more...]
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