The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic cooling [3-6]. These investigators have found that the mass transfer process can be set up with cleaner boundary conditions and can be studied more … [Read more...]
The Role of Natural Graphite in Electronics Cooling
Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of this brief, natural graphite. The basic structure of graphite is shown in Figure 1. Figure 1. Structure of graphite crystal. The … [Read more...]
The Challenge of Operating Computers at Ultra-low Temperatures
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance. But as minimum feature size passed well into the sub-micron and now into the nanometer region, this route to higher performance has … [Read more...]
The Anisotropic Thermal Conductivity of Plastics
The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating media. Roughly, if more filler is used, then higher thermal conductivity is achieved. Phenomena related to manufacturability and strength often … [Read more...]
The submerged double jet impingement (SDJI) method for thermal testing of packages
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is one of the main functions of the package. To fully characterize the package thermally, numerical simulations and experimental tests are … [Read more...]
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