This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the board temperature (TB), then the junction temperature (TJ) can be determined by a simple application of the following formula: TJ … [Read more...]
An alternative approach to junction-to-case thermal resistance measurements
As more and more integrated circuits dissipate power at levels once reserved for power discrete devices, junction-to-case thermal resistance (JC or RJC) remains as important as ever. The difficulties in making JC measurements often leads to values that do not accurately indicate true junction temperature (TJ). The measurement difficulties are usually two-fold. First is … [Read more...]
Visualization of air flows in electronics systems
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple shapes, such as cubical metal blocks simulating electronic components, often exhibit multi-dimensional flow phenomena that include … [Read more...]
Don't underestimate radiation in electronic cooling
don't underestimate radiation in electronics cooling Bruce M. Guenin, Ph.D., Associate Editor, Amkor Technology, Inc. It is easy to underestimate the role of thermal radiation as a significant contributor to electronics cooling in environments without forced air flow. By its very nature it is invisible. The proper treatment of it can be intimidating due to the complicated … [Read more...]
Component thermal characterization
For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an intricate set of interrelationships between a large number of hardware and software vendors who balance cooperative and competitive market strategies. Key elements in … [Read more...]
- « Previous Page
- 1
- …
- 153
- 154
- 155
- 156
- 157
- …
- 178
- Next Page »
