Thermal experts generally view thermal resistance as a measurable property of a semiconductor device. A system designer, who designs an appliance, is usually not a thermal expert. The system designer just needs a way to determine the size of the external heat sink. At high heat sink temperatures, less power dissipation is allowed in the device. The ratio at which case … [Read more...]
The treacherous streams
During the development of a telecommunications product, an unpredictable phenomenon of air streams within the maze of cards and module was encountered. It could only be compared to suddenly confronting powerful inner streams in a calm ocean. Unlike the ocean, however, these streams appeared in a man-made machine. It seemed as if someone had rewritten the laws of physics. It was … [Read more...]
The thermal conductivity of air
In the Technical Data column of ElectronicsCooling Magazine, September 1998, the thermal conductivity of gases in general has been discussed. A few sentences were devoted to the temperature and pressure dependence of the most common gases. For example, it was stated that above 0.001 bar, the increase in thermal conductivity is of the order of magnitude of 1% per bar increase of … [Read more...]
Managing power requirements in the electronics industry
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access - coupled with expanding needs for all modes of electronic communications - have resulted in telecommunications systems that exhibit dramatic increases in power … [Read more...]
Natural convection modeling of heat sinks using web-based tools
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
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