For decades, the worldwide electronics industry has produced a stream of products that continue to amaze us with their capabilities, their compactness, and their low price. This track record is due, in part, to an intricate set of interrelationships between a large number of hardware and software vendors who balance cooperative and competitive market strategies. Key elements in … [Read more...]
CFD: One measly letter away from CAD
"The stuff you engineers design is too good," the guy from Marketing said, "I need shoddier! Can you make them less efficient and cheaper?" I was working for a small company that made electric power conditioning equipment. Our devices protected against spikes, sags and brownouts in the AC power for mission-critical equipment like air traffic control radar and the computer … [Read more...]
We still have a headache with Arrhenius
"We have a headache with Arrhenius" was attributed to Takehisa Okada, Senior General Manager of Sony Corporation, when asked about Sony's perspective on reliability prediction methods during a U.S. Japanese Technology Evaluation Center visit.[1] The thermal environment is an important consideration in the design of electronics. Temperatures that arise during the use of … [Read more...]
Managing power requirements in the electronics industry
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access - coupled with expanding needs for all modes of electronic communications - have resulted in telecommunications systems that exhibit dramatic increases in power … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
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