Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
Multilayer circuitry on metal substrates
Today's electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling systems may include conduction, convection and radiation cooling. Conduction can be the most efficient mode of heat transfer and about … [Read more...]
Thermal challenges in the telecom and networks industry
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The second is to ensure high dependability of the network. While doing thermal design, many challenges must be kept in mind: the … [Read more...]
Temperature of in-line array of electronic components simulated by rectangular blocks
An earlier work by the authors (Molki et al., 1995) discussed the adiabatic heat transfer coefficient of rectangular blocks situated in an in-line array. In real circuit boards, heat is generated by a number of electronic components. The temperature of each component is affected by two factors, self-heating and thermal wake effect. Self-heating is the temperature rise due to … [Read more...]
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT. To summarize the uses of these metrics: JA represents the junction-to-air thermal resistance for a package tested in an industry-standard test environment. It is … [Read more...]
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