Ceramics are increasingly used in packages and printed circuit boards, because they have a number of advantages over plastics: much higher thermal conductivity, possible match of the coefficient of thermal expansion, and hermetic sealing. Unfortunately, the cost of ceramics is still much higher than that of plastics, prohibiting their use in low-cost high-volume products. … [Read more...]
High performance thermal management materials
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of thermal expansion Extremely high strength and stiffness Low densities Low cost, net shape fabrication … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
The thermal conductivity of aluminum oxide
Aluminum Oxide (Al2O3) is an important ceramic for the electronics industry. Besides its use as a passivation layer on Silicon, the ceramic is often used as a carrier for thick and thin film passive components and for other small printed circuit boards. A relatively low cost is combined with a relatively high thermal conductivity, especially when compared to FR4 board material. … [Read more...]
Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
All phase change thermal interface materials are designed to minimize the thermal resistance in an interface between a heat generating component and a heat sink. How well they achieve this goal in a specific application depends on how judiciously their phase change characteristics are matched to the interface specifications. The purpose of this paper is to present the results … [Read more...]
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