IEEE Standard 1332-1998 [IEEE 1998] requires that, "The [equipment] supplier shall determine the customer's requirements and product needs," and that, "The [equipment] supplier, working with the customer, shall include the activities necessary to ensure that the customer's requirements and product needs are fully understood and defined, so that a comprehensive design … [Read more...]
Thermal design of fault tolerant and high availability computer systems
Thermal Design is one of the most challenging aspects of computer system design. This is definitely the case when it comes to designing for “fault tolerance” and “high availability” in high-speed multiprocessor-based systems. The inherent challenges associated with fault tolerance not only bring demanding design requirements but headaches as well. The term fault tolerance … [Read more...]
Uncertainty analysis
Uncertainty analysis is the process of estimating the uncertainty in a result calculated from measurements with known uncertainties. Uncertainty analysis uses the equations by which the result was calculated to estimate the effects of measurement uncertainties on the value of the result. Uncertainty analysis is used in the planning stages of an experiment to judge the … [Read more...]
Thermal characterization of active components
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment) were evaluated by component suppliers. The methods were improved for practical application and extended to a large … [Read more...]
The thermal conductivity of aluminum oxide
Aluminum Oxide (Al2O3) is an important ceramic for the electronics industry. Besides its use as a passivation layer on Silicon, the ceramic is often used as a carrier for thick and thin film passive components and for other small printed circuit boards. A relatively low cost is combined with a relatively high thermal conductivity, especially when compared to FR4 board material. … [Read more...]
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