Today's market offers many heatsink attachment and thermal interface options. Your design decisions usually aim to optimize product performance at minimum cost. Secondary effects, not always sufficiently considered, significantly impact production cost, delivery performance, and reliability. These effects stem from the impact of the heat sink attachment design on the product … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part 1
One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard test environment are often used in this endeavor. The most common thermal metric [1,2] is the junction-to-air thermal resistance, JA (pronounced theta, … [Read more...]
Uncertainty analysis
Uncertainty analysis is the process of estimating the uncertainty in a result calculated from measurements with known uncertainties. Uncertainty analysis uses the equations by which the result was calculated to estimate the effects of measurement uncertainties on the value of the result. Uncertainty analysis is used in the planning stages of an experiment to judge the … [Read more...]
Thermal characterization of active components
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment) were evaluated by component suppliers. The methods were improved for practical application and extended to a large … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
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