Acoustic noise emission is one of several physical design issues addressed during the design of telecommunications and information technology equipment. In most systems, noise is a by-product of the air-movers used for system cooling. The amount of heat dissipated in electronic systems cooled by forced convection is directly proportional to volumetric flow rate. The flow rate, … [Read more...]
Use of junction-to-board thermal resistance in predictive engineering
The readers of "Electronics Cooling" are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you realize that vendors cannot continue to state the integrated circuit will work at a specified ambient temperature (55°C, 70°C, 85°C, or 125°C) as device … [Read more...]
The thermal conductivity of pure metals
As discussed previously in this section, the measurement of the thermal conductivity is notoriously difficult. The consequence is that, while the measurement accuracy by individual researchers is claimed to be of the order of 2%, laboratories participating in round-robin tests produce results differing from each other by 15% or more [1]. Even the measurement of pure metals is … [Read more...]
Improving productivity in electronic packaging with flow network modeling (fnm)
As the complexity and power density of electronics systems increase, so too does the demand for tools to improve both product quality and designer productivity. This is especially true for thermal designers who use Computational Fluid Dynamics (CFD) tools for thermal designs. Several important factors are driving this trend: System complexity has increased to the point that … [Read more...]
Graphite fiber reinforced al and cu alloys for thermal management applications
Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today's electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in less volume. To meet these challenges, electronic systems must dump large amounts of waste … [Read more...]
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