In the last decade, we've come a long way in the application of thermal analysis to the design of electronics. And there's no sign of the pace of innovation changing. Engineers are still being challenged to build faster, smaller and cheaper products in ever-decreasing design times. Fortunately, the engineering software industry has been able to respond by providing tools that … [Read more...]
Adjusting temperatures for high altitude
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and qualify such products. There are a variety of corrections used to account for this effect, many of which sacrifice accuracy for simplicity. … [Read more...]
Design and reliability considerations in avionics electronics packaging
In the avionics industry, regulatory agencies and standards organizations, such as Federal Aviation Regulation (FAR) [1], Aeronautical Radio, Inc. (ARINC) [2], and Radio Technical Commission for Aeronautics (RTCA) [3], have developed sets of test procedures that help design engineers test and verify their designs and prevent any safety-threatening failures. Too often, however, … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
High performance thermal management materials
Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of thermal expansion Extremely high strength and stiffness Low densities Low cost, net shape fabrication … [Read more...]
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