Accident? Consider the scenario where a designer wishes to incorporate a newly developed device into a system and soon learns that a heat sink is needed to cool the device. The designer finds a rather large heat sink in a catalog which marginally satisfies the required thermal criteria. Due to other considerations, such as fan noise and cost constraints, an attempt to use a … [Read more...]
Thermal management of outdoor enclosures using phase change materials
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and deployed such as broadband ISDN, cellular and/or cable, heat dissipation densities will increase substantially [1]. Furthermore, the introduction … [Read more...]
Integrated thermal network models are still useful
Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the need to predict integrated systemperformance on the basis of the individual component … [Read more...]
Coefficient of thermal expansion
As complexity increases and dies and packages become even larger, temperature gradients also increase, leading to problems with thermal mismatch. Hence, thermomechanical analysis grows in importance. Apart from the temperature differences, the most important parameter describing thermally induced stress is the coefficient of thermal expansion (CTE, or °), expressed in units of … [Read more...]
Highly emissive ion beam textured surfaces for improved cooling of electronic devices
Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be realized by increasing thesurface area of these devices. However, increasing the size of heatexchanger components is not a … [Read more...]
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