Figure 1: Standard situation Figure 2: Required situation Introduction The future of many electronic companies will depend to a large extent ontheir ability to initiate techniques that bring schedules, performance, tests,support, production, life cycle costs, reliability prediction and qualitycontrol into the earliest stages of the product creation process. The … [Read more...]
Specifying filters for forced convection cooling
Introduction The importance and utility of air filters is often underestimated since itis typically an after-thought in the design cycle. The wrong filter is oftenused for an application which may compromise the electrical and thermalperformance of the system as a result of contaminant build-up. In this article,different filter designs and the selection process is reviewed to … [Read more...]
Making surface temperature measurements using liquid crystal thermography
Introduction The development of liquid crystal (LC) based thermography overthe past 30 years has provided thermal engineers with a relatively inexpensivetechnique for visualizing and measuring surface temperature. Engineers andscientists have successfully used LC thermography to investigate various thermalphenomena in a wide variety of applications. These applications … [Read more...]
Fan cooled enclosure analysis using a first order method
Introduction Most Electronics Packaging Engineers and Analysis Specialists have access toa wide range of high quality analysis tools. While a few computer programs useanalytical methods, the majority are based on numerical analysis techniques.Although these programs are becoming easier to use, they typically requireconsiderable skill, and they are certainly capable of producing … [Read more...]
How to Select a Heat Sink
With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the … [Read more...]
