The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development and experimental validation of thermal models of avariety of `generic' electronic parts. DELPHI (which stands for … [Read more...]
Applying computational fluid dynamics to heat sink design and selection
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on approximations and correlations; and experimental work. Whether theapplication includes single or multiple heat sinks, the … [Read more...]
Making surface temperature measurements using liquid crystal thermography
Introduction The development of liquid crystal (LC) based thermography overthe past 30 years has provided thermal engineers with a relatively inexpensivetechnique for visualizing and measuring surface temperature. Engineers andscientists have successfully used LC thermography to investigate various thermalphenomena in a wide variety of applications. These applications … [Read more...]
Fan cooled enclosure analysis using a first order method
Introduction Most Electronics Packaging Engineers and Analysis Specialists have access toa wide range of high quality analysis tools. While a few computer programs useanalytical methods, the majority are based on numerical analysis techniques.Although these programs are becoming easier to use, they typically requireconsiderable skill, and they are certainly capable of producing … [Read more...]
Thermal conductivity of printed wiring boards
The thermal management of printed circuit boards is of increasing importanceas the power density of components and circuits continues to rise. Thesituation is complicated by the use of boards with multiple sheets of copperembedded in the electrically insulating boards to provide electromagneticshielding and to allow more three-dimensional connectivity of the circuitry bythe use … [Read more...]
