Power densities in electronic subsystems continue to increase, driving demand for more extreme cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling are exploring innovative combinations of component materials, including … [Read more...]
Transient and Steady State Thermodynamic Modeling of Modular Data Centers
The following transcript and video were originally presented at Thermal LIVE by Rehan Khalid. For access and information on all Thermal LIVE events, both past and present, please visit https://thermal.live/. Today we're going to be looking at the work I did for my master's, titled Transient and Steady State Thermodynamic Modeling of Modular Data Centers. So what we're … [Read more...]
Human-Centric Value for Smart Data Centers
In the data center world, innovation means “survival!” But innovation should not make systems more complicated, rather it should make systems usable and useful by focusing on the users, their needs, and requirements. However, the problem is that the human-centric approach to data center management is often overlooked, which places undue stress on managers as they question the … [Read more...]
High-Volume PCB Assembly is Key to Saving on PCB Design
A PCB circuit is the key component of every electronic device. So, you can imagine the demand for the PCB circuit in this era of advanced electronic technology. To compensate for the demand, the electronic manufacturer has also required a PCB circuit supply parallel to the need. In this situation, High Volume PCB Assembly acts as a boon for designing the PCB. A high-volume … [Read more...]
Simulation for Printed Circuit Board Design Reliability
The following transcript and video were originally presented at Thermal LIVE 2017 by David Geb. For access and information on all Thermal LIVE events, both past and present, please visit https://thermal.live/. Graham Kilshaw: Good morning. It is 11:00 in Philadelphia. And welcome to Thermal LIVE 2017. I'm Graham Kilshaw with Electronics Cooling Magazine. … [Read more...]
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