In a quest to increase surface heat removal rates for electronics packaging, impinging jet cooling promises to be effective and inexpensive. Most impingement cooling systems use open pipes. These are effective but have drawbacks such as high impingement forces on the target surface. In the last 10 years radical nozzles have been shown in the laboratory to benovel and … [Read more...]
How to Select a Heat Sink
With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the … [Read more...]
