Previous articles in this series described how thermocouple wire size [1] and thermocouple attachment method [2] can affect steady state temperature measurements. This article briefly discusses how these factors can affect the transient response of thermocouples when used to monitor temperatures that change value over time. Bare Thermocouple Junction Before addressing … [Read more...]
Tech Brief: Radiation Basics: When Does It Matter?
Introduction This is the first installment in a series of articles that aim to explore a range of practical topics on radiation that will be relevant to those of us focused on electronics cooling and thermal design. While radiation is one of the three fundamental modes of heat transfer, it is often the last topic covered in an introductory heat transfer course. This may … [Read more...]
Tech Brief: Thermocouple Attachment
The previous article in this series on thermocouples described how the size of the thermocouple wire could affect its accuracy [1]. This is particularly true if the wire is exposed to high convection coefficients. This article addresses a separate issue, namely the degree to which the attachment method impacts thermocouple readings. As it turns out, once again the … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
