As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to dissipate. Wireless designers are tasked with finding new ways to keep these devices from overheating without … [Read more...]
Thermal Interactions between High-power Packages and Heat Sinks, Part 2
Calculation Corner Bruce Guenin, Assoc. Technical Editor Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the … [Read more...]
Keeping Cool When You are Heading to the Sun
The Parker Solar Probe is defying common sense and pushing the limits of thermal performance via innovative design as it loops and approaches to within just a few million kilometers from our Sun. Thermal management in outer space is hard, that’s not news. Even after the heat has been conveyed by conduction to the outer surface of the spacecraft, there’s only radiation as a … [Read more...]
Larger Errors with Smaller Stuff
Thermal Facts and Fairytales by Ross Wilcoxon Long time readers of Electronics Cooling will undoubtedly recall one of our former editors: Clemens Lasance. One of Clemens’ many contributions to the magazine was the creation of the original “Thermal Facts and Fairy Tales” column, which provided a forum for him to discuss a variety of issues related to the use and misuse of … [Read more...]
JEDEC Thermal Standards: Developing a Common Understanding
JEDEC Thermal Standards: Developing a Common Understanding The Joint Electron Device Engineering Council (JEDEC) was established to provide recognized technical standards for a wide range of applications, from how to handle electronic packages and defining package outline drawings, to the methods used to characterize performance, including thermal. The JC-15 committee … [Read more...]
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