Taking on the challenge of placing ever more powerful electronics into increasingly small and complex devices has meant that electronic and thermal simulation are now vital parts of the engineering design flow. But with smaller geometries and higher power densities these challenges only get more acute. For starters the fact that the physical space within which electronic … [Read more...]
Balancing Local Versus Global Cooling Requirements
When you’re planning how to solve the ongoing problem of keeping things cool enough, it’s easy to mentally blur the lines between hot components and hot boxes. The difficulty is that the solution for one of these may not be adequate or appropriate for the other. Here’s the situation: in most systems, the heat sources are not distributed uniformly across the circuit board … [Read more...]
Wanted: Director of Business Development
We're hiring a talented sales professional to support Interference Technology and our other publications. Read more below! And if you're interested, contact Graham Kilshaw at graham@item.media Title: Director of Business Development ITEM Media (Publisher of Electronics Cooling), Philadelphia region, PA Compensation Competitive base plus commission Multiple … [Read more...]
Some Remarkable Highlights at EMC EUROPE 2018 Amsterdam Symposium
This top-level technical and scientific event is the most important English-speaking EU annual EMC symposium and exhibition. The program may be downloaded here: https://www.emceurope2018.org/footer/final-programme-opt.pdf It travels always to a different EU country. About 50% of the submitted papers were rejected in the review process. Close … [Read more...]
How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics has led to miniaturization, use of plastic housing, and more applications from the existing electronics in the market. The model for analysis consists of multi-layered Cu-FR4 Printed Circuit Board (PCB) … [Read more...]
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