Thermal management in high performance electronics has become a leading challenge for design and reliability engineers. Harsh temperatures can be caused either by harsh operational conditions (high power dissipation), or by harsh environmental conditions. Both require adequate thermal management to ensure that the product temperature stays within acceptable limits. High … [Read more...]
7 Most Common Myths About Heat Pipes
Overview Over many decades, Boyd has led innovation of superior heat pipe and two-phase thermal management solutions across many major industries from mobile and consumer electronics to NASA applications and next-generation enterprise and 5G equipment. We’ve observed many misconceptions about heat pipes, how they work, and how to best utilize them in applications while working … [Read more...]
Why Low Gassing Adhesives Matter
The aerospace, electronic, and optical industries often involve environments where outgassing from adhesives can pose significant challenges. When exposed to vacuum or elevated temperatures, conventional adhesives may release volatile compounds, leading to contamination or performance degradation of sensitive components. To mitigate these risks, engineers might consider low … [Read more...]
Blue Laser Welding Increases Vapor Chamber Fabrication Efficiency
We all understand that higher circuit density and increasingly compact microelectronic devices have created a need for more efficient cooling. Vapor chambers have emerged as a widely employed solution in some of the most demanding microelectronics applications. They are already found in high-performance computers, such as servers, workstations, and personal gaming desktops and … [Read more...]
Adding Function, Value, and Performance to Direct-to-Chip (DTC) Cold Plates With Ultrasonic Additive Manufacturing
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance performance and functionality.” The direction of Artificial intelligence and High Power Computing … [Read more...]
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