Greetings to all Electronics Cooling’s loyal readership and visitors, I have recently had the privilege of joining the Electronics Cooling team alongside the incredible Editorial Board and ITEM Media. My goal as part of the team is to help the experts on the Editorial Board and ITEM Media production staff to continue driving Electronics Cooling to add the most value to its … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
Thermal Energy Harvesting with Next Generation Cooling for Automotive Electronics
Co-authored by: Feng Zhou, Shailesh N. Joshi, Ercan M. Dede Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI 48105, US INTRODUCTION In 2012, vehicle fuel-efficiency standards were announced that require all US cars and light trucks to reach 54.5 miles per gallon on average by model year 2025. As a result, … [Read more...]
Thermal Management and Safety Regulation of Smart Watches
ABSTRACT A smart watch is one of the most popular wearable devices now. Along with battery life and security, thermal safety is the most common concern. We show how to meet the ergonomic standards for users and predict thermal performance in typical scenarios. Thermal simulation software applied at the design stage can provide guidance on the use of heat spreading materials … [Read more...]
Reliability of Nano-sintered Silver Die Attach Materials
Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
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