Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
Thermal Management of On-board Chargers in E-Vehicles
Electric vehicles are poised for a rapid growth phase with the combined effect of longer range, lower battery cost and faster charging rate. In particular, sales of plug-in electric vehicles (PEV) have tripled since 2013 and continue to grow at over 40% a year. It is expected that at these growth rates, 8 out of 10 new cars sold globally in 2030 will be a PEV. In some countries … [Read more...]
Does a 10°C Increase in Temperature Really Reduce the Life of Electronics by Half?
This may seem like a silly question to ask in a magazine entitled “Electronics Cooling”, but why do we really care what temperature of electronics really is, anyway? The simple answer to that question is that it is universally recognized that electronics reliability when devices are too hot for too long of a time. The difficult answers to the question are in defining exactly … [Read more...]
From Measurements to Standardized Multi-Domain Compact Models of Light Emitting Diodes (LED)
Co-authored by: Genevieve Martin*, Andras Poppe, Sangye Lungten, Veli Heikkinen, Joan Yu, Marta Rencz, Robin Bornoff *Corresponding Author Introduction The rise of LED technology is changing the ecosystem of the lighting industry. Delphi4LED [1] is a European Union consortium that is responding to these changes by providing the EU LED Lighting industry with a set of tools … [Read more...]
Simulation Driven Design Optimization for Reduction of Temperature on a High Current Density PCB
Co-authored by: Nitesh Kumar Sardana, Susyamala Pavan Kumar Busam, Dr. Laxmidhar Biswal Robert Bosch Engineering and Business Solution Pvt. Ltd. Abstract The market demand for lightweight and cost effective electronic products with multi-functional operations leads to the introduction of plastic housing and high current density on board. In general, automotive electronic … [Read more...]
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