By Terence Graham and Bonnie Mack, Ciena Corporation Introduction In Part 1 of this article [1] the overall thermal environment for pluggable optical modules (POMs) was described, with the effect of both out of flatness and source locations relative to heatsink contact area also examined. The article also introduced the relevant sections of the multi-source agreements … [Read more...]
Thermal Facts and Fairy Tales: Fairy Tales About Heat Sink Performance Calculations
Clemens J.M. Lasance, Guest Editor, Philips Research Emeritus, Consultant@SomelikeitCool When Peter Rodgers invited me to again write a Thermal Facts and Fairy Tales (TF&F) column, I immediately thought of a recent webinar on basic heat sink calculations that I attended, in order to get an idea of the current status-quo in these matters. Well, in my humble view there was … [Read more...]
Thermal Live! 2016 Promises A Broad Coverage of Electronics Thermal Management Topics
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Our annual online conference “Thermal Live! 2016” starts next week on the 4th of October and concludes on the 5th. These all day FREE webinars by well-known industry experts representing various thermal management solution providers are “must attend” events for designers and engineers … [Read more...]
Calculation Corner: Spreadsheet-based Matrix Analysis – Extension to Transient Analysis
by Ross Wilcoxon, Ph.D., Associate Technical Editor Over the years, a number of articles [1-3] published in ElectronicsCooling have described the use of thermal resistance networks to analyze electronic systems. The analysis of a thermal resistance network begins by defining discrete nodes that are connected with resistors, with the magnitude of a flow between nodes defined … [Read more...]
Surface Temperatures of Electronics Products: Appliances vs. Wearables
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
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