by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Our annual online conference “Thermal Live! 2016” starts next week on the 4th of October and concludes on the 5th. These all day FREE webinars by well-known industry experts representing various thermal management solution providers are “must attend” events for designers and engineers … [Read more...]
Calculation Corner: Spreadsheet-based Matrix Analysis – Extension to Transient Analysis
by Ross Wilcoxon, Ph.D., Associate Technical Editor Over the years, a number of articles [1-3] published in ElectronicsCooling have described the use of thermal resistance networks to analyze electronic systems. The analysis of a thermal resistance network begins by defining discrete nodes that are connected with resistors, with the magnitude of a flow between nodes defined … [Read more...]
Surface Temperatures of Electronics Products: Appliances vs. Wearables
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
Comparison of Heatsinks used for the Thermal Management of LEDs
By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional heatsinks. However, advances in manufacturing processes and increasing access to simulation tools provide new … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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