by MP Divakar, PhD, Stack Design Automation (www.stack-da.com) Technical Editor, Electronics Cooling Online It gives me great pleasure to join the electronics thermal management community as the Technical Editor for the online edition of Electronics Cooling Magazine. Electronics-Cooling.com remains the preeminent online resource for all things related to the cooling of … [Read more...]
Electronics Cooling June 2016 Issue Now Online
Don’t miss out on the June 2016 Issue of Electronics Cooling, which includes feature articles on The Hidden Risk of Invisible Airflow Imbalance in Data Centers, Application of Phase Change Materials in Handheld Computing Devices, and more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2016 issue here … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements
Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the implications of subjecting thermal requirements on suppliers or coworkers. A rush to get a quick answer or to use the latest feature in an analysis software code … [Read more...]
Tech Brief: Visualization of Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins
Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high heat fluxes from electronic packages such as 3D stacked chips. Flow boiling in microchannel arrays has been employed in many applications[1-3], and boiling … [Read more...]
- « Previous Page
- 1
- …
- 42
- 43
- 44
- 45
- 46
- …
- 178
- Next Page »
