The World’s First Liquid-Cooled Gaming Laptop The Asus ROG GX700 has been introduced as the world’s first liquid-cooled gaming laptop. Asus ROG Global Marketing Director Derek Yu created the inch-thick laptop with a Nvidia GTX 980M graphics card, and with the cooling system as a “massive, alien-like pod filled with the extra hardware” that plugs right into the laptop, … [Read more...]
Electronics Cooling March 2016 Issue Now Online
Don’t miss out on the March 2016 Issue of Electronics Cooling, which includes feature articles on Enhanced Two-Phase Impingement Technologies for Electronics Cooling; Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices; iNEMI Roadmap Identifies Trends Impacting Electronics Thermal Management; and more. If you would like to receive your free copy of … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
The Appification of CFD Simulation has Started
There has been much talk about the appification of established technologies. Discussion on the appification of high-value CAE simulation seems to have focused on the fact that it's a when, not if. How such a conclusion has been made without a clarification of what 'appification' actually is, is confounding. Apps are cheap, limited in the scope of their application and, as a … [Read more...]
Room Temperature Metal Bonding – Heralding a Revolution In IC Performance and Reliability?
A reliable electronic product is generally a cool one. In addition, one of the main limiters of non-functional performance is operating temperature. Keep your product cool and it will last longer and/or operate faster. Electronics thermal management has been dogged by thermal resistances at part/part interfaces for decades. Reduce these main bottlenecks in the heat flow path … [Read more...]
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