Introduction Established heatsink manufacturing processes such as extrusion, casting and milling constrain the achievable topology and geometry of the heatsink. The advent of metallic 3D printing (additive manufacture) processes such as selective laser melting (SLM) may remove many of these constraints, forcing the designer to reconsider the approach taken to determine a … [Read more...]
Electronics Cooling September 2015 Issue Now Online
Don’t miss out on the September 2015 issue of Electronics Cooling, which includes feature articles on Heatsink Geometry Topology; On-site Cogeneration for Reducing Data Center Primary Energy Use; a Thermal Live Advance Program; and more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the September 2015 issue … [Read more...]
A Couple of Other Electronics Thermal Blogs…
Blogs are a great outlet if you are passionate about a subject. I've been running this blog on mentor.com for over 6 years now and I hope you've enjoyed reading them as much as I have writing them! Long may it continue. Here are a couple of other electronics thermal blogs that may also be of interest: Chris Hill's at NXP, 'The accidental thermal engineer': … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits
By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate thermal integrity of the packages and cooling solutions [1]. In advanced silicon technologies (sub-45nm nodes), the chip’s thermal … [Read more...]
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