Don’t miss out on the September 2015 issue of Electronics Cooling, which includes feature articles on Heatsink Geometry Topology; On-site Cogeneration for Reducing Data Center Primary Energy Use; a Thermal Live Advance Program; and more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the September 2015 issue … [Read more...]
A Couple of Other Electronics Thermal Blogs…
Blogs are a great outlet if you are passionate about a subject. I've been running this blog on mentor.com for over 6 years now and I hope you've enjoyed reading them as much as I have writing them! Long may it continue. Here are a couple of other electronics thermal blogs that may also be of interest: Chris Hill's at NXP, 'The accidental thermal engineer': … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits
By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate thermal integrity of the packages and cooling solutions [1]. In advanced silicon technologies (sub-45nm nodes), the chip’s thermal … [Read more...]
The Holy Books of Heat Transfer: Facts or Fairy Tales
By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is both! It all depends on whether or not your situation is truly similar to the situation described in the book (physically congruent, fluid mechanically and thermally similar). Very few heat transfer books provide detailed dimensions and flow conditions for the experimentally observed … [Read more...]
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