The shape of the small piece of geometry that is added so as to successively ‘relieve’ the design determines the overall ‘jaggedness’ of the final geometry. A square section rod can only lead to a stair-stepped representation of angled portions of the shape, at worse resulting in a 41% increase (2/root2) in surface area in those regions. Increase in surface area, thus … [Read more...]
Organically Grown 3D Printable Heatsinks – Part 2 Trunks and Branches
Adrian Bejan’s Constructal Law states: “For a finite-size system to persist in time (to live), it must evolve in such a way that it provides easier access to the imposed currents that flow through it.” This can be seen at play in both animate and inanimate systems, from trees to lighting, from river systems to lungs. Such persistent systems tend to carry something … [Read more...]
Organically Grown 3D Printable Heatsinks – Part 1 A Simple Iterative Procedure
This is what a typical extruded fin heatsink looks like. It’s made of metal and sits on top of IC packages that themselves are soldered to a PCB. It cools those packages by providing an increased air apparent surface area with which to pass on the heat that has been conducted up through it. Its shape (topology) is in most ways set by the manufacturing process used to create it. … [Read more...]
Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks
Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report, the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to a chip stack and thus supports increased communication bandwidth and power density. In addition, in a two-die stack, all … [Read more...]
Thermal Facts and Fairy Tales Past Data and Columns
Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and their associated thermal properties used in electronics packaging were covered. Table 1 lists a summary of the technical data columns divided … [Read more...]
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