Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and their associated thermal properties used in electronics packaging were covered. Table 1 lists a summary of the technical data columns divided … [Read more...]
Strategies for the Thermal Modeling of Metal Traces on Printed Circuit Boards
Bruce Guenin, Assoc. Technical Editor Introduction As integrated circuit (IC) devices get more complex, the interconnections between them provided by printed circuit boards (PCBs) get more complicated as well. Thermal simulation software tools are getting more capable of importing PCB layouts and automating the process of creating a model of the PCB whose local thermal … [Read more...]
Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics
Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s Information-Communications-Technologies (ICT) infrastructure, a general representation of cloud-based computing, is estimated to … [Read more...]
Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate
Ercan M. Dede INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases and under-hood space becomes further constrained, semiconductor device power densities continue to rise (in excess of 200 W/cm2) resulting in … [Read more...]
Circuit Credit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes
Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies (CCA). OHP-embedded heat sinks efficiently transport heat generated by CCA centrally located components to the assembly’s … [Read more...]
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