Jim Wilson, Engineering Fellow Raytheon Company I have a small book in my office labeled “Suggestions for Designers of Navy Electronic Equipment, 1970 Edition” that was given to me several years ago by the editor at microwaves101.com (which happens to be a useful website if you are interested in microwave topics). The introduction states that any or all of this information is … [Read more...]
Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads
Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique. A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates with copper circuit traces attached to them and semiconductor elements soldered between them. TECs are now available … [Read more...]
Solder Joint Lifetime of Rapidly Cycled LED Components
Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to improve visual experience, either through application of active LEDs in an ambient light feature, or through dimming and boosting of the display LEDs in a … [Read more...]
Challenges in Measuring Theta jc for High Thermal Performance Packages
Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is straightforward. However, the difficulty lies in making an accurate case temperature, Tc, without affecting the junction temperature, Tj, and the … [Read more...]
Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package
Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
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