Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Electronics Cooling June 2014 Issue Now Online
Don’t miss out on the June 2014 issue of Electronics Cooling, which includes feature articles on Solder Joint Lifetime of Rapidly Cycled LED Components; Advances in Vapor Compression Electronics Cooling; Challenges in Measuring Theta jc for High Thermal Performance Packages; and more. If you would like to receive your free copy of Electronics Cooling click here to … [Read more...]
Ramping Up for THERMINIC! Abstract Deadline 28th May 2014
The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed. We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality of abstracts submitted … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
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