Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in which test measurements and analysis were conducted in steady-state conditions to characterize the thermal … [Read more...]
Electronics Cooling March 2014 Issue Now Online
Don’t miss out on the March 2014 issue of Electronics Cooling, which includes the 2014 Buyers' Guide and feature articles on Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing; Ultra-Thin Titanium Based Thermal Solution for Electronic Applications; Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization; and … [Read more...]
Relationship between Supply Flow Rate of Small Cooling Fans and Narrow Flow Passages in High-Density Packaging Electronic Equipment
Takashi Fukue and Koichi Hirose Dept. of Mech. Eng., Iwate University Tomoyuki Hatakeyama and Masaru Ishizuka Dept. of Mech. Syst. Eng., Toyama Prefectural University Katsuhiro Koizumi Cosel Co., Ltd. Introduction Forced convection driven by cooling fans is widely used for removing heat from electronic equipment. A net cooling performance of the cooling fans is … [Read more...]
Towards Reproducible ASTM D5470 Measurements at Lower Cost
Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be tested in its application to conclude its merits. Standardized testing is useful, however, for comparing TIMs in research and … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks
Bruce Guenin Associate Technical Editor, Electronics Cooling INTRODUCTION The previous column, "Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)" dealt with the application of JEDEC thermal metrics to IC packages that do not have heat sinks attached to them [1]. The methods are applicable to prediction of the junction … [Read more...]
- « Previous Page
- 1
- …
- 59
- 60
- 61
- 62
- 63
- …
- 178
- Next Page »
