Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
Editorial
Recently I read an article on cutting-edge research demonstrating the feasibility of data storage on media for a million years! A few years ago this might not have resonated with me as a thermal engineer working to cool electronics, but now it does. Let me explain why. Research & Development on IT equipment thermal management over the past few decades has justifiably … [Read more...]
Thermal Facts and Fairy Tales: Evolving the Role of the Thermal Engineer from Analyst to Architect
Scott Johnson, Raytheon Space and Airborne Systems Brendon Holt, Raytheon Missile Systems Evolving trends within the aerospace industry are creating a new set of challenges that directly influence thermal management choices and planning that should be addressed in the early phases of the product development process. Within the functional side of the aerospace industry, … [Read more...]
Thermal Packaging – From Problem Solver to Performance Multiplier
The increased integration density of electronic components and subsystems, including the nascent commercialization of 3D chip stack technology, has exacerbated the thermal management challenges facing electronic system developers. The sequential conductive and interfacial thermal resistances associated with the prevailing “remote cooling” paradigm in which heat must diffuse … [Read more...]
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