Author Clemens J.M. Lasance, Guest Editor Fact: many papers discussing LED thermal management issues report values of about 100 W/cm2 and use the same arguments that are valid for ICs to demonstrate that some critical value has been reached. The question to be addressed: is this indeed a fact, or can it be shown to be a fairy tale, and hence do we need different … [Read more...]
Understanding the Thermoreflectance Coefficient for High Resolution Thermal Imaging of Microelectronic Devices
Authors Kazuaki Yazawa, Microsanj/Purdue University Dustin Kendig, Microsanj Peter E. Raad, TMX Scientific/SMU Pavel L. Komarov, SMU Ali Shakouri, Purdue University Introduction Thermoreflectance thermal imaging is an optical technique for measuring, with external illumination, the relative change in the surface reflectivity as a function of temperature for a … [Read more...]
Calculation Corner – Application of Transient Thermal Methods to Moisture Diffusion Calculations, Part 2
Bruce Guenin, Assoc. Editor, Electronics Cooling View Part 1 here. Introduction This two-part column was motivated by concerns regarding the important role of organic materials in electronic systems and their accompanying vulnerabilities due to moisture diffusion. The methods described herein are intended to provide an efficient means of predicting the rate of moisture … [Read more...]
Electronics Cooling 2013 Buyers’ Guide Issue Now Online
Don’t miss out on the March 2013 issue of Electronics Cooling, which includes the 2013 Buyers’ Guide, feature articles on Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs, … [Read more...]
Experiment vs. Simulation, Part 3: JESD51-14
The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external … [Read more...]
- « Previous Page
- 1
- …
- 66
- 67
- 68
- 69
- 70
- …
- 178
- Next Page »
