Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2012 issue here. Download your copy of the June 2012 issue here. … [Read more...]
Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance
Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high power design spaces that previously only employed copper lid heat spreaders. Exposed die flip chip packages are used frequently in lower power … [Read more...]
Spray Cooling Heat Transfer – Test and CFD Analysis
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances, yielding significant reduction in overall thermal resistance. Due to the complexity and chaotic nature of millions of … [Read more...]
Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known
Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
Metal Foam-PCM: Heat Storage Technology: The Thermal Charging Scenario
For optimal operation of electronics, the generated heat must be removed and hot spots must be mitigated. If the junction temperature increases above a specified limit, some electronic components may fail, or experience a decline in performance. Excess temperature also causes thermal stresses that lead to fracture of electronic packages. Phase change materials (PCMs) are … [Read more...]
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