It can be an amusing thing to notice how sometimes things come full-circle in our lives. My involvement with heat transfer began in college and continued through grad school and a post doc, as I conducted experiments involving liquid helium, both as a refrigerant and the object of study. Since liquid helium was such a precious refrigerant, a key strategy for achieving these … [Read more...]

Three dimensional (3D) integration is considered a very promising technology for integrated circuit design [1]. It offers numerous opportunities to designers looking for more cost-effective system chip solutions. It allows further decrease in the form factor of today's systems and eases the interconnect performance limitation since the components are integrated on top of each … [Read more...]