Global custom engineered thermoplastics compounder RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires. The new compounds have been specially formulated to increase the thermal management design options available for LED lighting as it expands into a broader range of end-use … [Read more...]
Electronics Cooling Buyers’ Guide Issue Now Online
Don’t miss out on the March 2012 issue of Electronics Cooling, which includes the 2012 Buyers' Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging, Enhancement of Microchannel Cooling with Oblique Technology, as well as technical briefs. If you would like to receive your free copy of … [Read more...]
Enhancement of Microchannel Cooling with Oblique Technology
Microchannel cooling has emerged as an effective method to enhance cooling for electronics devices [1]. However, the problem of boundary layer development, as liquid coolant travels downstream, persists in conventional microchannel heatsinks. Consequently, convective heat transfer performance of a heat sink deteriorates in the axial direction, resulting in elevated maximum … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
Ionic Winds: A New Frontier for Air Cooling
AIR-COOLING IS THE oldest and, in many ways, the easiest method of cooling electronics, whether it be through fan-driven forced convection or simply natural convection. However, with the increasing speed of processors, shrinking of form factors, and expansion of device functionality, air-cooling has begun to find itself on the outside looking in as new cooling technologies are … [Read more...]
- « Previous Page
- 1
- …
- 73
- 74
- 75
- 76
- 77
- …
- 178
- Next Page »
